1C31122G01 Using the data output module

1C31122G01 Using the data output module

Some ways DGND to Protective Earth referencing happens are as follows:  Connecting DGND to Protective Earth directly in the field device.  Connecting multiple cable shields directly to protective earth at the field devices, with cable runs and device to control separation longer than 30 m (100 feet).  Connecting DGND to Protective Earth indirectly, AC coupling, via intentional filter capacitance.  Connecting the field device’s power or its power reference to Protective Earth with transient limiting devices like a Metal Oxide Varistor or Transient Voltage Suppression Diode.  Stray Coil capacitance from the actuator coil to the shaft or housing on multiple actuators and grounding the shaft or housing due to the attachment mechanisms.In all cases, the cable from the VME module (MicroNet I/O Card) to the FTM module or relay box for field wiring may have an additional ground point added. For relay boxes or relay driver FTMs, this is required in marine installations. In EMC environments where sensitive equipment coexists or harsh conditions like high current or high voltage noise exist, the additional ground will help with noise suppression and immunity.

Cabinet Structural Grounding

  The cabinet needs to be a six-sided EMI shielded enclosure. The interior surfaces must be conductive and coated with corrosion protection treatments.  The enclosure floor and/or top must provide holes for cable entry, only the floor or top panels may be used. Top and bottom cable entry areas must be restricted in size, largest dimension of any aperture (hole) no greater than 152 mm (6 inches). This is particularly important when RF transmitters, like push to talk radios or cell phones, can be located near the cable access areas.  The cabinet frame and mounting areas must be bonded (grounded together).

The insulation on the cable between the MicroNet and FTM or relay box must be removed to expose the shield, being careful not to cut the shield or nick the inner insulation layers. A metal "P-clip" or similar clamping mechanism is used around the cable shield to ground the shield within 300 mm (12 inches) of the FTM or relay box. The grounding mechanism should be galvanically compatible with the tin-plated copper shield inside, as well as the grounding point in the cabinet (mounting panel). Typically metal "P-clips", annealed for some spring tension, made of either stainless steel or tin-plated copper are readily available commercially and are acceptably compatible.

All MicroNet chassis mounting screws 

(#8-32 M4) should be installed to properly ground the chassis to the mounting plate.  Frame shall be electrically connected at each structural interface (<2.5 mΩ).  Mounting plates shall be electrically connected to structural frame (<2.5 mΩ). o 6 places minimum — 4 corners + 2 mid-points, 8 places preferred.  Cabinet Doors must be electrically connected to the main structural frame (<2.5 mΩ) and must be mounted using conductive EMI gaskets along the length of the interface.  Cover panels shall be electrically connected to structural frame (<10 mΩ) and must be mounted using conductive EMI gaskets along the length of the interface.  Floor and top must be electrically connected to structural frame (<2.5 mΩ) and must be mounted using conductive EMI gaskets along the length of the interfaces.  DIN rail must be electrically connected to structural frame (<2.5 mΩ). o Once every 300 mm (12 inches), use a minimum of 2 screws to bond a DIN rail to cabinet frame.

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