AMAT 0190-09484 Temperature Controller Module
Product Details Introduction
The semiconductor Internet of Things, Big data and artificial intelligence (Al) require rapid and significant improvements in chip power efficiency, performance, area, cost and time to market (PPACT). This challenge is the force behind our new industry strategy, and in order to meet these needs, the entire industry is starting to collaborate in new ways. We choose parallel innovation over serial innovation and provide improved chips for the Al era. Applied Materials is committed to accelerating this new PPACT action manual to promote greater collaboration across the entire ecosystem - from materials to systems, from systems to materials, to accelerate customers and partners. We have the broadest and most in-depth product portfolio to provide innovative Ppact products to the market. This product portfolio includes the ability to create and store, shape and remove, modify, analyze, and connect materials and equipment in new ways. Our uniqueness lies in our extensive set of process technology and metrology capabilities, as well as our highly differentiated silicon and packaging laboratory capabilities. Our integrated material solutions jointly optimize material deposition, re value modification, and analysis, creating new materials and designing new structures for high-performance, low-power chips at cutting-edge nodes. Our investment in the most advanced digital infrastructure combines sensors, Metrology, data science, machine learning and simulation to help us shorten the product development cycle; Accelerate the transfer of new technologies from laboratories to wafer factories; And optimize cost, output, and yield for customers in batch production
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2410ML-05W-B60-D23 | 5STP24H2800 | 7114NHU-VAR148 |
3615KL-05W-B50-PR1 | 5STP24L2200 | AC-PIN-51 |