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  • LAM 810-072906-005 connects to the backplane circuit board
  • LAM 810-072906-005 connects to the backplane circuit board
  • LAM 810-072906-005 connects to the backplane circuit board
LAM 810-072906-005 connects to the backplane circuit board LAM 810-072906-005 connects to the backplane circuit board LAM 810-072906-005 connects to the backplane circuit board

LAM 810-072906-005 connects to the backplane circuit board

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LAM 810-072906-005 connects to the backplane circuit board

Product Details Introduction

LAM 810-072906-005 is a backplane circuit board used for connecting semiconductor manufacturing equipment. Backplane circuit boards play a crucial role in complex electronic systems, typically used to connect multiple circuit modules or components, providing channels for electrical connections and signal transmission.

Main features and functions:

Module interconnection: Backplane circuit boards are used to connect multiple independent circuit modules or components, such as control modules, sensor modules, driver modules, etc., to ensure smooth transmission of electrical signals and power distribution between them.

High reliability: Designed for harsh industrial environments, especially in semiconductor manufacturing equipment, to ensure long-term stable operation and reliable signal transmission.

High density connectivity: supports high-density connector configurations, can accommodate multiple connector interfaces, and adapt to complex circuit design requirements.

Signal integrity: In design, emphasis is placed on signal integrity to reduce electromagnetic interference (EMI) and crosstalk, ensuring accurate transmission of high-frequency signals.

Modular design: Modular design allows device manufacturers to configure and expand the backplane according to specific application requirements, enhancing the flexibility and adaptability of the system.

Heat dissipation design: Backplane circuit boards usually integrate good heat dissipation design to help the system maintain stable operation under high power density conditions.

Application areas:

Semiconductor manufacturing equipment: widely used in core equipment of semiconductor production lines, such as etching machines, lithography machines, deposition equipment, etc., responsible for connecting and integrating various control modules.

Automation system: In an automation control system, it is used to connect controllers, I/O modules, and actuators to ensure the coordinated operation of the entire system.

Testing and measuring equipment: used in testing instruments and measuring devices to connect various functional modules and ensure accurate transmission of testing signals.

Data communication system: In data communication equipment, it is used to connect and organize multiple communication modules to ensure the stability and efficiency of data transmission.

Advantages:

High reliability: The backplane circuit board undergoes rigorous testing and certification to ensure reliable performance under high loads and complex environments.

Flexible configuration: supports multiple connector and module configurations, adapts to the design requirements of different devices, and facilitates system expansion and upgrades.

Easy maintenance: Modular design makes maintenance and replacement easier, reducing equipment downtime and improving production efficiency.

Strong durability: Using high-quality materials and precision manufacturing processes to ensure excellent performance even in harsh working environments.

Product image

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PMB33E-00201-03AMAT 0100-35067PFRL101A 0.5KN 3BSE023314R0003
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