Brooks Automation 002-7391-25 Wafer Alignment Device

Brooks Automation 002-7391-25 Wafer Alignment Device

Product Details Introduction

Brooks Automation's 002-7391-25 wafer aligner is a high-precision wafer positioning device specifically designed for precise alignment of wafers in semiconductor manufacturing processes. This aligner can be fine tuned on multiple axes to ensure precise alignment of the wafer during processing and testing, improving manufacturing accuracy and efficiency.

main features 

High precision alignment: This aligner is equipped with advanced sensors and control systems that can achieve sub micron level accuracy, ensuring that wafers are always in precise positions during handling and processing.

Multi axis adjustment: Supports multi axis adjustment functions, including X, Y plane and rotation angle (Theta) adjustment, suitable for various complex alignment requirements.

Quick response and alignment: The design has optimized the alignment speed, enabling quick completion of wafer alignment operations, adapting to high-speed manufacturing processes, and reducing processing time.

Non contact alignment technology: Using non-contact sensor technology, it reduces damage to the wafer surface, making it particularly suitable for high-end wafer manufacturing that is sensitive to surfaces.

Stability and reliability: Durability and stability are considered in the design, which can maintain high-precision alignment for a long time and is suitable for high load production environments.

application area 

Semiconductor manufacturing: widely used in processes such as photolithography, etching, and ion implantation that require extremely high wafer positioning, ensuring precise positioning of the wafer between different process steps.

Packaging and Testing: During wafer level packaging and chip testing, aligners can ensure the position of each wafer or chip, helping to reduce testing errors and losses.

Other high-precision manufacturing: suitable for other precision manufacturing scenarios that require precise alignment, such as microelectromechanical systems (MEMS) and sensor manufacturing.

technical specifications

Alignment accuracy: sub micron level accuracy, meeting the requirements of high-precision wafer processing.

Non contact sensor type: Supports multiple sensor options for detecting wafer edges and centers, achieving non-contact alignment.

Compatibility: Can be integrated into various automation equipment and manufacturing systems, supporting compatibility with mainstream semiconductor communication protocols.

The Brooks 002-7391-25 wafer aligner is a critical alignment tool in semiconductor manufacturing, which improves the efficiency and yield of wafer processing through its high precision, multi axis adjustment, and non-contact design.

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