LAM 810-800082-243 Printed Circuit Board

LAM 810-800082-243 Printed Circuit Board

Product Details Introduction

LAM 810-800082-243 printed circuit board (PCB) is a high-precision and high reliability circuit board produced by LAM Research, commonly used in semiconductor manufacturing equipment, especially in highly complex equipment such as chemical vapor deposition (CVD) and etching equipment. As one of the core components, it undertakes multiple functions such as signal transmission, power management, and device control.

Main features:

High quality materials

This PCB uses high-quality materials such as high-frequency substrates and precision metallization technology to ensure stable performance in complex and demanding environments.

Multi layer design

This printed circuit board typically has a multi-layer structure, ensuring sufficient signal transmission channels while reducing interference and optimizing electrical performance. Multi layer design improves its load-bearing capacity and signal transmission accuracy.

Durability and stability

Designed according to industrial standards, it has high resistance to heat, interference, and mechanical vibration. Especially suitable for long-term operation in high-temperature and high humidity environments of semiconductor manufacturing equipment.

Accurate signal processing

This circuit board is responsible for precise processing of various signals and can seamlessly communicate with other control systems through specific interface modules.

High density packaging technology

By adopting high-density packaging (such as SMT) and compact layout, the space utilization of the circuit board has been optimized, while improving electrical performance and response speed.

Typical applications:

Semiconductor manufacturing equipment

An automated control system for processes such as etching, thin film deposition, and ion implantation.

Chemical Vapor Deposition (CVD) Equipment

Used for precise control of gas flow rate, current, pressure, and other parameters in CVD reaction chambers.

Plasma cleaning equipment

Used for high-precision cleaning of semiconductor wafer surfaces to ensure high consistency of the process.

Automated testing equipment

Used for testing and analyzing the performance of semiconductor chips, supporting data transmission, processing, and analysis.

Technical parameters (assuming reference, specific model and application need to be confirmed):

Size: Customized sizes are usually provided based on the design and installation requirements of the equipment.

Power requirements: According to electrical design, common operating voltages are+12V DC and+24V DC, depending on equipment requirements.

Working temperature range: Suitable for industrial environments, typically ranging from -20 ° C to+70 ° C.

Connection interface: usually supports various industrial standard interfaces, such as USB, Ethernet, RS-232, etc.

Signal types: including analog signals, digital signals, and high-frequency signal processing.

PCB Layers: Generally designed in multiple layers to accommodate complex circuits and compact layout requirements.

Product imag

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