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  • Hollysys FM821 Digital I/O module
Hollysys FM821 Digital I/O module

Hollysys FM821 Digital I/O module

Hollysys FM821 Digital I/O module

The enclosure must have suitable flame-retardant properties to prevent or minimize the spread of flame, complying with a flame spread rating of 5VA, V2, V1, V0 (or equivalent) if non-metallic. The interior of the enclosure must be accessible only by the use of a tool. Subsequent sections of this publication may contain additional information regarding specific enclosure type ratings that are required to comply with certain product safety certifications. In addition to this publication, see: • Industrial Automation Wiring and Grounding Guidelines, Rockwell Automation publication 1770-4.1, for additional installation requirements. • NEMA 250 and IEC 60529, as applicable, for explanations of the degrees of protection provided by different types of enclosure.

Mount the Module

For effective cooling, mount the module following these guidelines. 

• Mount the module horizontally. 

• Provide a gap of at least 100 mm (3.94 in.) above and below the module. 

• Select a location where air flows freely or use an additional fan. 

• Do not mount the module over a heating device.

The module cannot be panel-mounted. 

Mount the module to a DIN rail by following the steps below. 1. Hook the top slot over the DIN rail. 2. Insert a flathead screwdriver into the gap between the housing and the latch and pull the latch downward. 3. Hold the latch down as you push the housing back onto the DIN rail. 4. Release the latch to lock the module onto the rail.To remove the module from the DIN rail, insert a flathead screwdriver into the gap between the housing and the latch and pull the latch downward as you lift the module off of the rail.

The module is functionally grounded through its DIN rail connection. A protective earth ground connection is required and is provided through a separate grounding screw on the upper left of the housing and marked with the grounding symbol . You must also provide an acceptable grounding path for each device in your application. For more information on proper grounding guidelines, refer to the Industrial Automation Wiring and Grounding Guidelines, publication 1770-4.1.

                                         

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