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GE DS200PLFMG1A Contact DC module

GE DS200PLFMG1A Contact DC module

GE DS200PLFMG1A Contact DC module

Area three is the “High Voltage Isolation Area.” The transceiver coupling transformer on all control modules (except the TP-RS485) provides electrical isolation between the control module’s local ground (primary side) and the network wiring (secondary side). The transformers and associated filter components are designed to withstand moderately large primary-to-secondary voltages (see the control module data sheets for the exact ratings). To take advantage of this isolation, it is important to keep application circuitry, logic ground, metal chassis parts, and other primary-side components at least 3.8mm (0.15 inches) away from the secondary area on the control module and the network connector.

Control Module Keepout Areas 

Figure 11 shows three “keepout” areas on the control modules. Area one, the “EMI Radiated Keepout Area,” covers the Neuron Chip and the PROM. This is the area of the control module that generates the most RF noise. Cables, long metal chassis parts, and drive circuits for external cables must be kept away from this part of the control module. Area two, the “EMI Susceptibility Area,” is the main twisted pair transceiver area on the control module, and any RF energy that couples into this part of the module circuit will be conducted out onto the network cable. High frequency and high-speed circuits should be kept well away from this area of the control module (and away from the network connector)

ESD Design Issues 

Electrostatic Discharge (ESD) is encountered frequently in industrial and commercial use of electronic systems9. Reliable system designs must consider the effects of ESD and take steps to protect sensitive components. Static discharges occur frequently in low-humidity environments when operators touch electronic equipment. The static voltages generated by humans can easily exceed 10kV. Keyboards, connectors, and enclosures provide paths for static discharges to reach ESD sensitive components such as the Neuron Chip. This section describes techniques to design ESD immunity into control module-based products.

                                        

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----------------------Ruichang Mingsheng Automation Equipment Co., Ltd----------------------

PLC module, programmable controller, CPU module, IO module, DO module, AI module, DI module

Network communication module,

Ethernet module, motion control module, analog input module, analog output module, digital input module, digital output

Module, redundancy module, power module, relay output module, relay input module, processor module


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