HONEYWELL SC-PCMX01 51307195-175 control module

A temperature profile of the MVME162-023 was developed in an MVME945 12-slot VME chassis. This board was loaded with one GreenSpring IP-Dual P/T module (position a) and three GreenSpring IP-488 modules (positions b, c, and d). One twenty-five-watt load board was installed adjacent to each side of the board under test. The exit air velocity was approximately 200 LFM between the MVME162 and the IP-Dual P/T module. Under these conditions, a 10° C rise between the inlet and exit air was observed. At 70° C exit air temperature (60° C inlet air), the junction temperatures of devices on the MVME162 were calculated (from the measured case temperatures) and did not exceed 100° C.

The following are some steps 

that the user can take to help make elevatedtemperature operation possible: 1. Position the MVME162 board in the chassis for maximum airflow over the component side of the board. 2. Avoid placing boards with high power dissipation adjacent to the MVME162. 3. Use low-power IP modules only. The preferred locations for IP modules are position a (J2 and J3) and position d (J18 and J19).

For elevated-temperature operation, the user must perform similar measurements and calculations to determine what operating margin exists in a specific environment.

FCC Compliance 

The MVME162 was tested without IndustryPacks in an FCC-compliant chassis and meets the requirements for Class A equipment. FCC compliance was achieved under the following conditions: 1. Shielded cables on all external I/O ports. 2. Cable shields connected to earth ground via metal shell connectors bonded to a conductive module front panel. 3. Conductive chassis rails connected to earth ground. This provides the path for connecting shields to earth ground. 4. Front panel screws properly tightened. For minimum RF emissions, it is essential that the conditions above be implemented. Failure to do so could compromise the FCC compliance of the equipment containing the module.

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