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  • HIMA F4101 Displacement drive clamp
HIMA F4101 Displacement drive clamp

HIMA F4101 Displacement drive clamp

HIMA F4101 Displacement drive clamp

This section describes the mapping of local resources as viewed by VMEbus masters. VMEbus Accesses to the Local Peripheral Bus The VMEchip2 includes a user-programmable map decoder for the VMEbus to local peripheral bus interface. The map decoder allows the user to program the starting and ending address and the modifiers the MVME197LE responds to. VMEbus Short I/O Memory Map The VMEchip2 includes a user-programmable map decoder for the GCSR (Global Control and Status Registers). The GCSR map decoder allows the user to program the starting address of the GCSR in the VMEbus short I/O space.

This chapter provides unpacking instructions

hardware preparation, and installation instructions for the MVME197LE VMEmodule. The MVME712X transition module hardware preparation is provided in separate manuals, refer to the Related Documentation section of this guide. Unpacking Instructions Note If shipping carton is damaged upon receipt, request that the carrier’s agent be present during unpacking and inspection of equipment. Carefully unpack the equipment from the shipping carton. Refer to the packing list and verify that all items are present. Save the shipping carton and packing materials for storing or reshipping of the equipment.

Hardware Preparation 

To select the desired configuration and ensure proper operation of the MVME197LE module, certain modifications may be necessary before installation. These modifications are made through switch settings as described in the following sections. Many other modifications are done by setting bits in control registers after the MVME197LE has been installed in a system. (The MVME197LE registers are described in the MVME197LE, MVME197DP, and MVME197SP Single Board Computers Programmer’s Reference Guide as listed in the Related Documentation section of this guide).Inspect the equipment for any shipping damage. If no damage exists, then the module can be prepared for operation according to the following sections of this chapter.

                                                         

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