Power Supply Connections and Ground Planes Use of one low impedance ground plane is recommended. The VEE pins should be soldered directly to the ground plane to reduce series inductance. If the ground plane is an internal plane and connections to the ground plane are made through vias, multiple vias can be used in parallel to reduce the series inductance, especially on Pin 23, which is the ground return for the output buffers. The exposed pad should be connected to the GND plane using plugged vias so that solder does not leak through the vias during reflow. Use of a 22 μF electrolytic capacitor between VCC and VEE is recommended at the location where the 3.3 V supply enters the PCB. When using 0.1 μF and 1 nF ceramic chip capacitors, they should be placed between the IC power supply VCC and VEE, as close as possible to the ADN2816 VCC pins.
If connections to the supply and ground are made through vias
the use of multiple vias in parallel helps to reduce series inductance, especially on Pin 24, which supplies power to the high speed CLKOUTP/CLKOUTN and DATAOUTP/ DATAOUTN output buffers. Refer to Figure 19 for the recommended connections. By using adjacent power supply and GND planes, excellent high frequency decoupling can be realized by using close spacing between the planes. This capacitance is given by C A/d pFε. PLANE 880 r where: r is the dielectric constant of the PCB material. A is the area of the overlap of power and GND planes (cm2 ). d is the separation between planes (mm).
Transmission Lines
Use of 50 Ω transmission lines is required for all high frequency input and output signals to minimize reflections: PIN, NIN, CLKOUTP, CLKOUTN, DATAOUTP, and DATAOUTN (also REFCLKP and REFCLKN, if a high frequency reference clock is used, such as 155 MHz). It is also necessary for the PIN/NIN input traces to be matched in length, and the CLKOUTP/ CLKOUTN and DATAOUTP/DATAOUTN output traces to be matched in length to avoid skew between the differential traces. The high speed inputs, PIN and NIN, are internally terminated with 50 Ω to an internal reference voltage (see Figure 20). A 0.1 μF is recommended between VREF, Pin 3, and GND to provide an ac ground for the inputs.
Company introduction
Temporal Ming sheng automation equipment co., LTD. Was established in April 02, 2021, registered jiujiang ruichang city in jiangxi province, east yi road no. 23 lake farmers 401 mall, the legal representative person Zhou Zuochen.
[Main Products]
Main products: PLC and DCS system spare parts modules of world famous brands
①Allen-Bradley 1756、1746、1747、1771、1785
②Schneider 140 Series PLC module
③General electric GE
IC693 IC697 IC698 Series PLC module
DS200 DS3800 DS215 IS200 IS215 IS220 Series gas turbine module
VMIVME Control module of series
④Bently:3500 series cards 3500/22M、3500/15、3500/92 And other products
⑤ICS TRIPLEX
⑥ABB Robots. FANUC Robots、YASKAWA Robots、KUKA Robots、Mitsubishi Robots、OTC Robots、Panasonic Robots、MOTOMAN Robots。
⑦EMERSON:Spare parts for OVATION system, WDPF system and MAX1000 system.
⑧ Invensys Foxboro: I/A Series system, FBM (field input/output module) sequential control, ladder logic control, accident recall processing, digital analog conversion, input/output signal processing, data communication and processing, etc. Invensys Triconex: redundant fault-tolerant control system, Zui modern fault-tolerant controller based on triple module redundancy (TMR) structure.
⑨Woodward:505 series governor 9907-164 And other products
⑩Bosch Rexroth:Indramat,I/O module,PLC CPU,Motors, drives and other products.
◆Motorola:MVME 162、MVME 167、MVME1772、MVME177and other products.