ABB LDMUI-001 Embedded control card
An intermediate range of stress voltages that can induce failure in a particular device type, when the device type can pass some stress voltages both higher and lower than this range. For example, a component with a failure window may pass a 500 volt test, fail a 1000 volt test and pass 2000 volt test. The withstand voltage of this device is 500 volts. HBM ESD tester. Equipment (also referred to as "tester" in this standard) that applies an HBM ESD to a component. Also referred to as an HBM Simulator.
Human Body Model (HBM) ESD.
An ESD event meeting the waveform criteria specified in this standard, approximating the discharge from the fingertip of a typical human being. Ips. The peak current value is determined by the current at time tmax on the linear extrapolation of the exponential current decay curve. The linear extrapolation should be based on the current waveform data over a 40 nanosecond period beginning at tmax. (See Figure 2A) Ipsmax. The peak current maximum value is the highest current value measured. This value includes the overshoot or ringing components due to internal test simulator RLC parasitics. (See Figure 2A) No Connect Pin. A package interconnect (pin, bump or ball) that is not electrically connected to a die.
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