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MOTOROLA MVME133XTS Serial Link Module

MOTOROLA MVME133XTS Serial Link Module

MOTOROLA MVME133XTS Serial Link Module

FAILURE CRITERIA A part is defined as a failure if it fails the datasheet parameters using parametric and functional testing. If testing is required at multiple temperatures, testing shall be performed at the lowest temperature first. 8.0 COMPONENT CLASSIFICATION ESD sensitive components are classified according to their HBM withstand voltage, regardless of polarity, as defined in Table 3.

Example of Pin Combinations 

This is an example for a 10 pin device with 2-Vdd, 2-Vss, 2-Vcc, 2-input and 2-output pins. The like-named supply pins are metallically connected on the die. The sequence number refers to the sequence of pin combinations for stressing.The maximum trailing current pulse level is defined as the maximum peak current level observed through a 10 kilohm test load (current = voltage across test load divided by 10 kilohm) after the normal HBM pulse(s). The time period to be evaluated for after-pulse leakage, is from 0.1 to 1 millisecond after the decay of the HBM current pulse. In the case that a spurious current pulse is observed, begin the 0.1 millisecond measurement point from the start of the spurious current pulse.

                                    

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