OVATION 1C31129G04 Analog output board

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hich are located on the roof or in the exterior walls near the down conductors, must be bonded to the down conductors because the possibility of a sideflash exists. A sideflash is an arc caused by a difference in potential between a down conductor and a metallic element. The bonding eliminates potential difference and prevents high current flow from damaging these components. (2) Recent changes in standard guidelines have redefined the outline of the zone protected by any one standard air terminal. Originally, the accepted standard indicated that the area protected was defined by a 60° cone starting at the tip of the air terminal, surrounding the terminal, and extending to earth, without regarding the terminal height.

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