The main products

Spare parts spare parts, the DCS control system of PLC system and the robot system spare parts,

Brand advantage: Allen Bradley, BentlyNevada, ABB, Emerson Ovation, Honeywell DCS, Rockwell ICS Triplex, FOXBORO, Schneider PLC, GE Fanuc, Motorola, HIMA, TRICONEX, Prosoft etc. Various kinds of imported industrial parts

Products are widely used in metallurgy, petroleum, glass, aluminum manufacturing, petrochemical industry, coal mine, papermaking, printing, textile printing and dyeing, machinery, electronics, automobile manufacturing, tobacco, plastics machinery, electric power, water conservancy, water treatment/environmental protection, municipal engineering, boiler heating, energy, power transmission and distribution and so on.

PROCESSOR 958481320100 350211080090 module

The CC030-Series Power Modules have a fixed current-limit set point. Therefore, as the output voltage is adjusted down, the available output power is reduced. In addition, the minimum output current is a function of the output voltage. As the output voltage is adjusted down, the minimum required output current can increase.The output overvoltage clamp consists of control circuitry, which is independent of the primary regulation loop that monitors the voltage on the output terminals. The control loop of the clamp has a higher voltage set point than the primary loop (see Feature Specifications table). This provides a redundant voltage-control that reduces the risk of output overvoltage.

The CC030-Series Power Modules are constructed with a specially designed, heat spreading enclosures. As a result, full load operation in natural convection at 50 °C can be achieved without the use of an external heat sink. Higher ambient temperatures can be sustained by increasing the airflow or by adding a heat sink. As stated, this data is based on a maximum case temperature of 100 °C and measured in the test configuration shown in Figure 20.

Thermal Considerations 

The CC030-Series Power Modules are designed to operate in a variety of thermal environments. As with any electronic component, sufficient cooling must be provided to help ensure reliable operation. Heat-dissipating components inside the module are thermally coupled to the case to enable heat removal by conduction, convection, and radiation to the surrounding environment. The thermal data presented is based on measurements taken in a wind tunnel. The test setup shown in Figure 20 was used to collect data for Figures 24 and 25. The graphs in Figures 21 through 23 provide general guidelines for use. Actual performance can vary depending on the particular application environment. The maximum case temperature of 100 °C must not be exceeded.