FOXBORO P0926HZ Analog input module

Metal flow processes such as welding, brazing, and silver soldering provide the lowest values of bond resistance. With such processes, the resistance of the joint is determined by the resistivity of the weld or filler metal, which can approach that of the metals being joined. The bond members are raised to temperatures sufficient to form a continuous metal bridge across the junction. (d) For reasons of economy, future accessibility, or functional requirements, metal flow processes are not always the most appropriate bonding techniques. It may then be more appropriate to bring the mating surfaces together under high pressure. Auxiliary fasteners such as bolts, screws, rivets, or clamps are employed to apply and maintain the pressure on the surfaces. The resistance of these bonds is determined by the kinds of metals involved, the surface conditions within the bond area, the contact pressure at the surfaces, and the cross-sectional area of the mating surfaces.

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