A-B 1786-RPFRXL/B Long distance optical fiber ring repeater

Properly applied to compatible materials, the bond provided by solder is nearly as low in resistance as one formed by welding or brazing. Because of its low melting point, however, soft solder should not be used as the primary bonding material where high currents may be present. (a) In addition to its temperature limitation, soft solder exhibits low mechanical strength and tends to crystallize if the bond members move while the solder is cooling. Therefore, soft solder should not be used if the joint must withstand mechanical loading. The tendency toward crystallization must also be recognized and proper precautions observed when applying soft solder. Soft solder can be used effectively in a number of ways. For example, it can be used to tin surfaces prior to assembly to assist in corrosion control.

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