HIMA F3 AIO 84 01 982200409 Remote I/O module

To achieve an effective and reliable bond, the mating surfaces must be free of any foreign materials, e.g., dirt, filings, preservatives, etc., and non-conducting films such as paint, anodizing, and oxides and other metallic films. Various mechanical and chemical means can be used to remove the different substances, which may be present on the bond surfaces. After cleaning, the bond should be assembled or joined as soon as possible to minimize recontamination of the surfaces. After completion of the joining process the bond region should be sealed with appropriate protective agents to prevent bond deterioration through corrosion of the mating surfaces. (a) Solid material such as dust, dirt, filings, lint, sawdust, and packing materials impede metallic contact by providing mechanical stops between the surfaces. They can affect the reliability of the connection by fostering corrosion.

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1.Focus on DCS, PLC, robot control system and large servo system. Main products: various modules/cards, controllers, touch screens, servo drives.

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