GE IC693CPU364-CJ Module card

Equip all power lines supplying shielded areas with power line filters. (5) Securely ground all metal shields. b. Bonding. The bonding requirements for EMP protection necessary to ensure a mechanically strong, low impedance interconnection between metal objects and to prevent the path thus established from subsequent deterioration through corrosion or mechanical looseness are the same as those for EMI protection as established in chapter 4. c. Entry plates. All metallic penetrations entering the protected area should enter at a common location, and all shielded cables, conduits, and pipes should be bonded to an entry plate. This plate should be designed and installed as described for EMI protection in chapter 4.

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